Dynatron Q14 Copper Base & Aluminum Fins with Heat Pipe Embedded 1.5U Server Air Cooler for LGA 1851/1700
Dynatron Q14 Copper Base & Aluminum Fins with Heat Pipe Embedded 1.5U Server Active Air Cooler for LGA 1851/1700 Socket
The Dynatron Q14 is a high-performance active air cooler designed specifically for 1.5U server chassis utilizing LGA 1851 and LGA 1700 sockets. This cooling solution features a robust copper base that ensures efficient heat transfer from the CPU, complemented by aluminum fins that facilitate effective airflow and heat dissipation. The embedded heat pipe enhances thermal conductivity, providing reliable cooling even under demanding server workloads. Constructed for durability and optimal thermal management, the Q14 is suitable for high-density server environments where maintaining optimal operating temperatures is critical. Its bulk packaging makes it ideal for large-scale deployments or system integrators seeking efficient cooling components in bulk quantities.
Features:
- Copper Base: Ensures excellent heat transfer from the CPU for efficient cooling.
- Aluminum Fins: Designed to maximize airflow and facilitate heat dissipation.
- Heat Pipe Embedded: Improves thermal conductivity for reliable temperature control.
- Compatibility: Suitable for LGA 1851 and LGA 1700 sockets in 1.5U server configurations.
- Bulk Packaging: Comes in a bulk package ideal for large-scale installation or inventory management.
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Product Information
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Dynatron Q14 Copper Base & Aluminum Fins with Heat Pipe Embedded 1.5U Server Air Cooler for LGA 1851/1700
Dynatron Q14 Copper Base & Aluminum Fins with Heat Pipe Embedded 1.5U Server Air Cooler for LGA 1851/1700
Dynatron Q14 Copper Base & Aluminum Fins with Heat Pipe Embedded 1.5U Server Active Air Cooler for LGA 1851/1700 Socket
The Dynatron Q14 is a high-performance active air cooler designed specifically for 1.5U server chassis utilizing LGA 1851 and LGA 1700 sockets. This cooling solution features a robust copper base that ensures efficient heat transfer from the CPU, complemented by aluminum fins that facilitate effective airflow and heat dissipation. The embedded heat pipe enhances thermal conductivity, providing reliable cooling even under demanding server workloads. Constructed for durability and optimal thermal management, the Q14 is suitable for high-density server environments where maintaining optimal operating temperatures is critical. Its bulk packaging makes it ideal for large-scale deployments or system integrators seeking efficient cooling components in bulk quantities.
Features:
- Copper Base: Ensures excellent heat transfer from the CPU for efficient cooling.
- Aluminum Fins: Designed to maximize airflow and facilitate heat dissipation.
- Heat Pipe Embedded: Improves thermal conductivity for reliable temperature control.
- Compatibility: Suitable for LGA 1851 and LGA 1700 sockets in 1.5U server configurations.
- Bulk Packaging: Comes in a bulk package ideal for large-scale installation or inventory management.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Dynatron Q14 Copper Base & Aluminum Fins with Heat Pipe Embedded 1.5U Server Active Air Cooler for LGA 1851/1700 Socket
The Dynatron Q14 is a high-performance active air cooler designed specifically for 1.5U server chassis utilizing LGA 1851 and LGA 1700 sockets. This cooling solution features a robust copper base that ensures efficient heat transfer from the CPU, complemented by aluminum fins that facilitate effective airflow and heat dissipation. The embedded heat pipe enhances thermal conductivity, providing reliable cooling even under demanding server workloads. Constructed for durability and optimal thermal management, the Q14 is suitable for high-density server environments where maintaining optimal operating temperatures is critical. Its bulk packaging makes it ideal for large-scale deployments or system integrators seeking efficient cooling components in bulk quantities.
Features:
- Copper Base: Ensures excellent heat transfer from the CPU for efficient cooling.
- Aluminum Fins: Designed to maximize airflow and facilitate heat dissipation.
- Heat Pipe Embedded: Improves thermal conductivity for reliable temperature control.
- Compatibility: Suitable for LGA 1851 and LGA 1700 sockets in 1.5U server configurations.
- Bulk Packaging: Comes in a bulk package ideal for large-scale installation or inventory management.
